> Zen4 , 2x CCD + IOD
Processor Technology for CPU Cores= TSMC 5nm FinFET
Processor Technology for I/O Die = TSMC 6nm FinFET
CPU Compute Die (CCD) Size= 71mm²
I/O Die (IOD) Size = 122mm²
Package Die Count = 3
71*2+122 = 264 mm² ami jobban el van szeparálva ( 3 db -ra )
mint az Intel 13900K ( 257 mm² )
Mottó: "A verseny jó!"
