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• #42722 Archttila veterán #16939776 #42700

  Új Válasz 2018-04-13 18:08:36 #42722

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  Archttila

  veterán

  válasz #16939776 #42700 üzenetére

  Van itthon egy EK m.2 heatsink csak kell majd egy furat a backplatre, mert pont ott türemkedik az alaplapom egy méretes SMD ahol nem kellene.
  Amúgy ehhez mit szólsz? (találékony HardForum-os tulajok)

  

  Toshiba OCZ RD400 1TB M.2 PCIe SSD on the back of a Asus Strix Z270i.

  All temps stated here are the M.2 SSD PCH reported by HWiNFO64.

  Without cooling solution - 70C at idle, 75C under normal use (gaming).
  With cooling solution (pic) - 47C at idle, 60C under normal use (30min gaming off said SSD - bottom AF-A9 @ 80%).

  Cooling solution:
  - Aluminium plate (rated 200W/mK 1.5mm thick) located between the motherboard and cage.
  - Arctic Silver 5 (rated 8.1W/mK, between aluminium and chipsets on M.2 SSD)
  - Thermal pad 7mm thick (rated 3.2W/mK, on the inner side of side panel, made up of 7x 1mm thermal pad)
  - Noctua AF-A9 at bottom (held down with Blu-Tack as there are no holes to screw down in that position),

  How the heat transfer works (my best guess):
  M.2 SSD PCH -> Aluminium Plate -> Cooled by air from AF-A9 (in picture)
  M.2 SSD PCH -> Aluminium Plate -> Thermal Pad -> Side Panel which dissipates heat

  WARNING: THE ALUMINIUM PLATE IS NOT PROPERLY SECURED. RECOMMEND SECURING IT PROPERLY, OR NOT USE THIS SOLUTION IF YOUR NCASE M1 IS TRANSPORTED FREQUENTLY.

  This is what I ended up with after many experimentation...
  Firstly the why - because I wanted to have a 3.5" HDD installed, and the side bracket is already occupied by a GPU radiator.
  Also the front of mobo is already occupied by another M.2 SSD (Samsung 960 Evo 1TB).

  I first started off with thermal pads alone (7mm thick) to make contact between the SSD and side panel to dissipate heat - 63C at idle.
  I replaced the 3.5" HDD below the motherboard with another AF-A9 (not in pic), positioned (not screwed down) as to send as much airflow up the back of the motherboard as possible - 38C idle, 52C under normal use with this 2nd AF-A9 at 80%,
  But then I wanted to use the only remaining HDD space, so came up with the above solution to utilise the only AF-A9 on the bottom of the case, by transferring heat there. Thus the aluminium plate solution.
  Applying the 7mm thermal pad was an afterthought which reduced the temp by another 3~5C.

  Electrical tape and Blu-Tack are being employed to ensure the plate doesn't move and cause electrical short for the time being.

  In the future I'd permanently glue the plate to the side panel, then around the SSD area add additional aluminium layer so that the plate makes contact with the chipset, then use a higher rated (>8W/mK) thermal pad between them.
  The additional layers + plate should add up to be about 8mm thick (so plate + 4 addnl layers for this 1.5mm aluminium), then a 0.5mm or 1mm thick thermal pad can be used to make the final contact between that and the SSD chipset.
  Thermal paste + glue should be used between the aluminium layers.
  By doing this, the thermal pad acts as a shield to prevent accidental shorting. Even if the plate fell it would be outside of the cage and shouldn't make contact with sensitive components (the above pic is inside, protected only by electrical tape).

  This solution betters the M.2 SSD (Samsung 960 Evo) on the front of the motherboard with Asus's own M.2 SSD cooling solution by a few degrees.
  However, the 960 Evo, as I understand, operates at a higher temp.

  Cost:
  - Aluminium plate (1.5mm x 20mm x 1metre) $3 from local hardware store
  - Thermal pad $10
  - Arctic Silver 5 $10
  - Metal cutting blade $5

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