Ez engem is megtévesztett hogy sokkal kevesebb chip van a 850-be, de megvan a megoldás.
Amikor arról beszéltek hogy sikerült 256Gb-es flash chip-t előálíítani akkor azt hittem hogy ez az egy chip-ben
létrehozható maximális kapacitásra utal, de nem 
Ez egy die kapacitása, amiből tudnak x réteget egymásra tenni, durva. Itt egy jó cikk hogy a TB-os ssd-kben hogy is van ez.
We covered this a bit on the previous article, but now that we've been able to lay out all capacities, we can present a clear picture on die count staggering among the entire line. Here are the flash memory packages we found installed:
K9LPGY8S1M - DDP (2 dies)
K9HQGY8S5M - QDP (4 dies)
K9PRGY8S7M - ODP (8 dies)
K9PRGY8S5M - ODP (8 dies)
K9USGY8S7M - 16 die stack
While the VNAND die capacity (86Gbit) is lower than the typical 128Gbit of 2D NAND, Samsung appears to be more adept at stacking it within a package, as we don't typically see 2D NAND at more than four dies per package, meaning higher capacity models of competing SSDs are forced to mount 16 packages on their PCBs.
The 'odd' die capacity means that to deliver the typical 2^n capacities that people are used to, Samsung had to stagger the package types. As an example, the 512GB 850 Pro needs 48 86Gbit dies. It accomplishes this with 4 QDP (4 die) packages and 4 ODP (16 die) packages. Other capacities perform the same trick, just with different staggering of package types. If Samsung were to keep with the typical uniform die counts per package, they could theoretically make the 850 Pro in capacities of 96GB, 192GB, 384GB, 768GB, and 1.5TB. Yes, 1.5TB could be possible in the current form factor, simply by using all 16 die stack packages, yielding 128 dies.
